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Seminars

Learn about upcoming seminars covering exciting and innovative research topics.

computer chip created by AI

Attend Future Frontiers: How AI Will Shape the Next Decade of Packaging, Aug. 13

Future Frontiers: How AI Will Shape the Next Decade of Packaging will examine the evolving relationship between AI technologies and packaging methods. This session may be of particular interest to faculty members engaged in research or instruction related to electronics, materials science, systems engineering or manufacturing.