Series:

Seminar series

computer chip created by AI

Attend Future Frontiers: How AI Will Shape the Next Decade of Packaging, Aug. 13

Future Frontiers: How AI Will Shape the Next Decade of Packaging will examine the evolving relationship between AI technologies and packaging methods. This session may be of particular interest to faculty members engaged in research or instruction related to electronics, materials science, systems engineering or manufacturing.

Julia Greer portrait

CANCELED: Attend an intelligentsia of nano-architected hierarchical materials seminar, April 12

Join the School of Manufacturing Systems and Networks as they host Julia Greer, professor of materials science and mechanics at Caltech, for a seminar on intelligentsia of nano-architected hierarchical materials. Agenda: Abstract Creation of reconfigurable and multi-functional materials can be achieved by incorporating architecture into material design. In our research, we design and fabricate three-dimensional…

April 12, 202410:30 a.m. - 11:50 a.m.