Attend Future Frontiers: How AI Will Shape the Next Decade of Packaging, Aug. 13

Faculty members are invited to join the ASU Engineering Professional Development Series for an exploration of how artificial intelligence, or AI, is influencing semiconductor packaging and electronic system design.

Future Frontiers: How AI Will Shape the Next Decade of Packaging will examine the evolving relationship between AI technologies and packaging methods. This session may be of particular interest to faculty members engaged in research or instruction related to electronics, materials science, systems engineering or manufacturing. The webinar will provide insights into how AI is being applied in advanced semiconductor packaging and what these developments mean for future research directions in the field.

Featured ASU faculty members
Hongbin Yu is a professor of electrical engineering in the School of Electrical, Computer and Energy Engineering and director of the National Science Foundation Industry-University Cooperative Research Center for Efficient Vehicles and Sustainable Transportation Systems. His research expertise includes nanodevice fabrication, wearable and transparent electronics, and semiconductor packaging as well as contributions to automotive electronics systems.

Christopher Bailey is a professor of electrical engineering in the School of Electrical, Computer and Energy Engineering and director of the Center for Advanced Semiconductor Packaging. His background encompasses computational mechanics, reliability modeling and leadership in CHIPS Act-funded research initiatives. He brings extensive experience in government and industry advisory roles.

Future Frontiers: How AI Will Shape the Next Decade of Packaging
Wednesday, Aug. 13, 2025
10–11 a.m.
Online via Zoom
Register now