The Center for Embedded Systems and Connection One, both NSF Industry/University Cooperative Research Centers (I/UCRC), recently held their Industry Advisory Board (IAB) semi-annual meetings at the Tempe campus.
The Center for Embedded Systems (CES) is working to advance the field of embedded systems in algorithms, applications and architectures to new levels. The Center has expertise in power, energy and thermal-aware design, robust IC and system design, software design for embedded systems, advanced embedded processor architectures, networked and distributed embedded systems and testing, fault tolerance and dependability.
In its third year as an NSF-designated center, CES has two academic sites and industry members from leading electronics and manufacturing companies including: Caterpillar, EMAC, General Dynamics, Hamilton Sundstrand, Intel, Marvell, Qualcomm, Raytheon, Rockwell Collins, Toyota and TSI / Dickey-john.
Connection One (C1) is focused on developing the next generation of wireless systems, integrated systems and sensors on a chip and bio-electronic systems to enhance technologies ranging from cellular to environmental and defense applications. The Center’s research covers a broad range of topics including antenna design, radio frequency integrated circuits, power management IC, analog and digital IC, modeling and CAD, MEMS, radiation hard electronics, sensor circuits and ultra-low power smart sensors.
C1, which will celebrate its 10 year anniversary this summer, has grown to 34 members and 36 funded projects. The meeting drew strong industry support—30 participants joined 20 faculty from ASU and other university partners, along with 25 graduate students.
Research from each of the centers was highlighted in the NSF’s 2012 compendium of industry-nominated technology breakthroughs. The compendium is intended to illustrate how center knowledge and technology are being translated into commercial and industrial applications.
CES innovations include a computer-aided design tool chain for developing the network-on-a-chip architecture for mobile processor chips. By automating the design process, device manufacturers achieve increased efficiency and development savings. CES researchers also developed S-TALIRO, a software tool that verifies correct system functionality in the safety-critical industries of automotive and aerospace systems.
Multiple Connection One industry sponsors are benefiting from a multi-mode transceiver that is completely integrated on one chip. By integrating RF, antenna, signal processing, video and image processing and microprocessors on one system, this technology enables reduced size and complexity and greater efficiency for communications transmitters and products. C1 researchers also developed meta-ground plane that reduces the size of bulky antenna systems, and provides extremely wide bandwidth.
The I/UCRC program fosters collaboration among academia, industry and government based on common research interests. The majority of center research is conducted by graduate students, under the guidance of university faculty, giving students first-hand knowledge of industrially relevant research. Intellectual property from the research projects is then shared among industry member companies.
Photos from the events: